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  • What Is The Classification Of The Laser Processing
    Jul 06, 2018

    The main Machining process include CNC Machining, CNC turning, Auto lathe turning, CNC Milling,Stamping, Sheet metal fabrication, Casting, Injection molding etc.

    Laser cutting technology is widely used in the processing of metal and non-metallic materials, which can greatly reduce the processing time, reduce the processing cost and improve the quality of the workpiece. Laser cutting is realized by using the high power density energy generated by laser focusing. Compared with the traditional plate processing method, laser cutting has the advantages of high cutting quality, high cutting speed, high flexibility (arbitrary shape cutting), wide material adaptability and so on.

    Laser welding is one of the most important aspects of the application of laser material processing technology. The welding process belongs to the heat conduction type. That is, the laser radiation heating the workpiece surface, the surface heat is diffused through the heat transfer to the internal diffusion. By controlling the width, energy, peak power and repetition frequency of the laser pulse, the workpiece is melted to form a specific molten pool. Special advantages, have been successfully applied to micro and small parts welding. Compared with other welding techniques, the main advantages of laser welding are: laser welding speed, depth, small deformation. It can be welded at room temperature or special conditions, and the equipment of welding is simple.

    With the development of portable and miniaturization of electronic products, laser drilling has put forward a higher and higher demand for the miniaturization of circuit boards. The key to improve the miniaturization level of the circuit board is the narrower and narrower line width and the smaller and smaller micro holes and blind holes between different layers of circuits. The minimum size of the traditional mechanical drilling is only 100 μ m, which obviously can not meet the requirements. Instead, a new type of laser micro-drilling method is adopted. By using CO _ 2 laser, the holes with the diameter of 30-40 μ m or about 10 μ m with UV laser can be obtained in industry. In the world, the research of laser in the fabrication of circuit board microhole and the direct forming of circuit board has become a hot spot in laser processing. Compared with other machining methods, the advantages of laser fabrication of microhole and circuit board are more prominent. Of great commercial value.

    The pulse laser can be used to perforate the laser. The pulse width is 0.1m / s, which is especially suitable for microholes and special-shaped holes, and the aperture is about 0.005mm. Laser drilling has been widely used in clock and instrument gem bearings, diamond wire drawing die, chemical fiber spinneret and other workpieces processing. In shipbuilding, automobile manufacturing and other industries, the continuous CO _ 2 laser of one hundred watt to ten thousand watts is often used to cut large workpiece, which can not only guarantee the accurate shape of space curve, but also have higher processing efficiency. Small-power solid-state lasers or CO2 lasers are commonly used for cutting small workpieces. In microelectronics, laser cutting silicon wafers or narrow slits are commonly used, with high speed and small heat affected zone. Laser can be used to print or mark the workpiece on the pipeline, which does not affect the speed of the pipeline, and the characters can be kept permanently.